Power Electronics Design Boot Camp Electrical, Thermal, EMI, Reliability, and New Devices
Upcoming dates (1)
Fee
- $1,695
-
Fee covers course materials and other: Online Instruction.
Discounts
The Wisconsin Electric Machines and Power Electronics Consortium (WEMPEC) Member Discount: $200 off the course fee.
ID
RA01448-C972
Credits
- CEU: 2
- PDH: 20
Schedule
- 6/6/2023 08:00am - 02:30pm Central Time
- 6/7/2023 08:00am - 02:30pm Central Time
- 6/8/2023 08:00am - 02:30pm Central Time
- 6/9/2023 08:00am - 02:30pm Central Time
Instructors
Thomas Jahns, Eric Persson, Bulent Sarlioglu
Location
This is an online course.
Cancellation Policy
If you cannot attend, please notify us no later than one week before your course begins, and we will refund your fee. Cancellations received after this date and no-shows are subject to a $150 administrative fee. You may enroll a substitute at any time before the course starts.
Course Overview
You will learn to master critical subjects for effective design of power electronics, like EMI/EMC, thermal, and reliability design and selection. Expert instructors in the field will teach you to analyze and control power electronic design. They will also expose you to new power electronic devices like Silicon Carbide (SiC) and Gallium Nitride (GaN) devices.
Who Should Attend?
This course will benefit persons working in the area of power electronics design, research, and development such as:
- Electrical engineers
- Mechanical engineers
- System engineers
- Program managers
- Project engineers
- Technical leaders
- System integrators
Participants should already have some basic acquaintance with power electronics fundamentals and will stress intermediate to advanced subjects. You should have a bachelor’s degree in engineering or a related science or the equivalent amount of industrial experience.
Course Outline
Review of Most Commonly Used Power
Electronic Topologies
- AC-DC, DC-AC, and DC-DC converters
- Pulse with modulation
Power MOSFET Devices and Applications
- Device structure: planar, trench, lateral, superjunction
- FET characteristics – interpreting a datasheet
- Thermal instability and hot-spotting in power devices (the Spirito effect)
- Switching characteristics, hard- and soft-switching
- FET body-diode characteristics, limits, and failure modes
- Package electrical and thermal characteristics
- Thermal models and transient thermal impedance
- Parallel operation of FETs – static and dynamic current sharing
- Safe Operating Area (SOA) – forward and reverse bias
IGBT Devices and Applications
- Device structure: PT, NPT, FS, co-pack diode
- IGBT characteristics – interpreting a datasheet
- Current handling and short-circuit capability
- Safe Operating Area (SOA) – forward and reverse bias, avalanche
- Switching characteristics – hard- and soft-switching
- IGBT packaging
- Thermal impedance and models – IGBT and diode
- Parallel operation of IGBTs – static and dynamic current sharing
- Short circuit protection in inverters
Gate Drives
- Parasitic impedance effects in fast-switching circuits
- How common source inductance affects switching behavior
- Inductively-limited switching and di/dt limits
- Using the Kelvin Source connection in gate drive circuits
- How much gate drive current and power is necessary?
Fundamentals of Capacitors in Power Electronic Circuits
- The four basic types their application spaces
- Sizing capacitors for a two-level VSI and a boost converter
- Techniques for capacitor integration/packaging
PCB Layout Effects
- Parasitic impedance, common-source inductance
- Capacitive coupling examples
- Inductive coupling examples
Wide Bandgap Power Devices (GaN and SiC) and Converters
- Comparing normally-on and normally-off device characteristics
- Static and dynamic characteristics and temperature dependencies
- Out charge Qoss – why a single number doesn’t tell the whole story
- Reverse conduction: cascade diode characteristics vs. HEMT diode-like behavior
- Interpreting double-pulse test results – capacitive charge versus true reverse-recovery
- Voltage ratings: overvoltage, breakdown
- Safe operating area and short-circuit capability
- Thermal characteristics, models
- Packaging considerations and parasitic impedances
Power Electronic Converter Design with SiC and GaN Devices
- Efficiency calculations
- Comparison with Si converters
Thermal Engineering Practice for Power Electronics
- Conduction and switching loss measurements and calculations
- Thermal impedance matrices and measurement techniques
- Transient thermal impedance and device thermodynamic models
- Basic properties of air and liquid heat exchanges
Reliability Engineering for Power Electronics
- Basic Weibull analysis
- Wearout mechanisms: cyclical fatigue and Arrhenius
- Power transistor and capacitor reliability calculations
Insulation and Dielectric Design
- Creepage and clearance
- Breakdown of air/gasses
- Corona and partial discharge
- Insulation thermal life and testing
Control and Dynamics
- Forward dynamics and disturbance rejection in power electronics
- Linear operating point models
- Power converter dynamics and state space averaging
EMI for Power Electronics
- EMI requirements, testing, and test setups
- Analysis of power electronic emissions
- Mitigation of power electronics emissions
Converter/Inverter PWM Modulators
- Differential mode characteristics
- Common mode characteristics
System Issues Excited by AC Drive CM and DM Voltages
- Motor over-voltages
- Bearing damage
Effect of High Frequency CM and DM on Application Hardware
- Sensors
- Plant equipment/protection
- Mitigation
Effect of High Frequency CM and DM on Control/Protection Components
- Drive sensor characteristics
- Current sensing
Influence of High Frequency on Power Device Switching Dynamics
- IGBT behavior
- Performance and mitigation
- Voltage measurement/observers
Instructors
Neal Clements
Neal Clements currently works as an engineering consultant (Neal Clements Engineering LLC in Grygla Minnesota) where he specializes in power electronics design, electromagnetic compatibility engineering, drives, and motor control. Dr. Clements has worked as a hands-on technical engineer for over 40 years in many areas of power electronics, pulsed power, vehicular electrical systems (aircraft, ship, and land based), automatic control systems and EMC among other areas. Dr. Clements holds a PhD and an MSEE from the University of Wisconsin, an MSEE from the University of Cincinnati, and a BSEE from the University of Toledo. He is a licensed professional engineer (P.E.) and a certified EMC engineer (iNARTE). Dr. Clements is a member of the IEEE, a member of the power electronics society of the IEEE (PELS), and a member of the EMC society of the IEEE.
Thomas Jahns
Dr. Thomas M. Jahns received his bachelors, masters, and doctoral degrees from MIT, all in electrical engineering.
Dr. Jahns joined the faculty of the University of Wisconsin-Madison in 1998 in the Department of Electrical and Computer Engineering. He served for 14 years as a Co-Director of the Wisconsin Electric Machines and Power Electronics Consortium (WEMPEC), a world-renowned university/industry consortium in the electrical power engineering field. Since 2021, he is the Grainger Emeritus Professor of Power Electronics and Electrical Machines.
Prior to coming to UW-Madison, Dr. Jahns worked at GE Corporate Research and Development (now GE Global Research) in Niskayuna, NY, for 15 years, where he pursued new power electronics and motor drive technology in a variety of research and management positions. His current research interests at UW-Madison include integrated motor drives and electrified propulsion for both land vehicles and aircraft.
Dr. Jahns is a Fellow of IEEE. He received the 2005 IEEE Nikola Tesla Technical Field Award “for pioneering contributions to the design and application of AC permanent magnet machines”. Dr. Jahns is a Past President of the IEEE Power Electronics Society. He was elected to the US National Academy of Engineering in 2015 and received the IEEE Medal in Power Engineering in 2022.
Russel Kerkman
Dr. Kerkman is a Distinguished Engineering Fellow with Rockwell Automation. His career spans 32 years in power electronics and adjustable speed drives and his current interests include adaptive control applied to field-oriented induction machines, design of AC motors for adjustable speed applications, and EMI from PWM inverters. Dr. Kerkman received his BSEE, MSEE, and PhD degrees in electrical engineering from Purdue University.
Eric Persson
Eric Persson is Executive Director of GaN Applications Engineering at Infineon Technologies. He is a semiconductor industry veteran with 15 years at International Rectifier, and a hands-on power electronic design engineer for 20 years before that. He has presented more than 70 seminars, tutorials and short courses on power electronics at various conferences and Universities around the world.
Bulent Sarlioglu
Bulent Sarlioglu is a Jean van Bladel Associate Professor at University of Wisconsin—Madison, and Associate Director, Wisconsin Electric Machines and Power Electronics Consortium (WEMPEC). Dr. Sarlioglu spent more than 10 years at Honeywell International Inc.’s aerospace division. As a staff system engineer, he earned Honeywell’s technical achievement award and an outstanding engineer award. Dr. Sarlioglu contributed to multiple programs where high-speed electric machines and drives are used mainly for aerospace and ground vehicle applications. Dr. Sarlioglu is the inventor or co-inventor of 20 US patents and many other international patents. He published more than 200 journal and conference papers with his students. His research areas are motors and drives including high-speed electric machines, novel electric machines, and application of wide bandgap devices to power electronics to increase efficiency and power density. He received the NSF CAREER Award in 2016 and the 4th Grand Nagamori Award from Nagamori Foundation, Japan in 2019. Dr. Sarlioglu became IEEE IAS Distinguished Lecturer in 2018. He was the technical program co-chair for ECCE 2019 and was the general chair for ITEC 2018. He is serving as a special session co-chair for ECCE 2020.
Power Electronics Design Boot Camp Electrical, Thermal, EMI, Reliability, and New Devices
Location: Online
Course #: RA01448-C972
Fee: $1,695
Fee
- $1,695
-
Fee covers course materials and other: Online Instruction.
Discounts
The Wisconsin Electric Machines and Power Electronics Consortium (WEMPEC) Member Discount: $200 off the course fee.
Credits
- CEU: 2
- PDH: 20
Schedule
- 6/6/2023 08:00am - 02:30pm Central Time
- 6/7/2023 08:00am - 02:30pm Central Time
- 6/8/2023 08:00am - 02:30pm Central Time
- 6/9/2023 08:00am - 02:30pm Central Time
Instructors
Thomas Jahns, Eric Persson, Bulent Sarlioglu
Location
This is an online course.
Cancellation Policy
If you cannot attend, please notify us no later than one week before your course begins, and we will refund your fee. Cancellations received after this date and no-shows are subject to a $150 administrative fee. You may enroll a substitute at any time before the course starts.
Power Electronics Design Boot Camp
Course #: RA01448Power Electronics Design Boot Camp -- Electrical, Thermal, EMI, Reliability, and New Devices
Date: Mon. May 23, 2022 – Thu. May 26, 2022ID: RA01448-C490
Fee:
- $1,695
-
Fee covers online instruction and course materials.
The Wisconsin Electric Machines and Power Electronics Consortium (WEMPEC) Member Discount: $200 off the course fee.
- CEU: 2
- PDH: 20
Power Electronics Design Boot Camp -- Electrical, Thermal, EMI, Reliability, and New Devices
Date: Mon. June 14, 2021 – Thu. June 17, 2021ID: RA01448-C086
Fee:
- $1,695
- Fee covers course materials and instruction. WEMPEC Discount: $200 off for WEMPEC Members. EPD will verify your affiliation.
- CEU: 2
- PDH: 20